1. 2. 3. material content data sheet sales product name its4140n issued 29. august 2013 ma# MA001121464 package pg-sot223-4-21 weight* 111.94 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 0.741 0.66 0.66 6620 6620 leadframe inorganic material silicon 7440-21-3 0.010 0.01 91 non noble metal titanium 7440-32-6 0.051 0.05 453 non noble metal chromium 7440-47-3 0.152 0.14 1359 non noble metal copper 7440-50-8 50.489 45.10 45.30 451037 452940 wire noble metal gold 7440-57-5 0.103 0.09 0.09 916 916 encapsulation organic material carbon black 1333-86-4 0.464 0.41 4147 plastics brominated resin - 0.580 0.52 5184 inorganic material antimonytrioxide 1309-64-4 1.161 1.04 10368 plastics epoxy resin - 10.561 9.43 94346 inorganic material silicondioxide 60676-86-0 45.262 40.43 51.83 404340 518385 leadfinish non noble metal tin 7440-31-5 1.464 1.31 1.31 13078 13078 plating noble metal silver 7440-22-4 0.513 0.46 0.46 4583 4583 glue plastics epoxy resin - 0.068 0.06 609 noble metal silver 7440-22-4 0.321 0.29 0.35 2869 3478 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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